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Findx F11-mini For iPhone 11 / 11 Pro / 11 Pro Max Reballing Stencil Platform Jig Fixture

filler
Precio:
$36.22
Stock:
Disponible

Descripción

1. Used to locate and relocate mobile phone PCB BGA parts
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm

Specification:
General
Compatible with
Apple:  iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11
Package Weight
One Package Weight 0.32kgs / 0.70lb
One Package Size 14.5cm * 10.2cm * 3cm / 5.71inch * 4.02inch * 1.18inch
Qty per Carton 80
Carton Weight 25.80kgs / 56.88lb
Carton Size 43cm * 32cm * 31cm / 16.93inch * 12.6inch * 12.2inch
Loading Container 20GP: 625 cartons * 80 pcs = 50000 pcs
40HQ: 1451 cartons * 80 pcs = 116080 pcs

Payment & Security

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