Descripción
1. Mechanic IX 5 Ultra universal breakthrough preheating platform, no air gun, no soldering iron, uniform heating
2. Layering / Tinning / Laminating / Degumming, Compact & Lightweight
3. Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature
4. Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair
5. Voltage: 110V /220V
6. Support motherboard delamination, lamination, and dot matrix repair
7. Preheating Temperature Range: 20~260 celsius degree
8. Product Size: 8 x 8 x 5.7cm
2. Layering / Tinning / Laminating / Degumming, Compact & Lightweight
3. Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature
4. Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair
5. Voltage: 110V /220V
6. Support motherboard delamination, lamination, and dot matrix repair
7. Preheating Temperature Range: 20~260 celsius degree
8. Product Size: 8 x 8 x 5.7cm
Specification:
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