Descripción
1. Pure copper material, a variety of specifications, smooth surface, rounded edges and corners, no burrs
2. Cooling the nearby ICs during maintenance to prevent tin popping
3. Thermal conductivity between the graphics card and cooling module and gap filler, improve thermal conductivity, reduce the graphics card repair rate
4. Thermal conductivity up to 401w/mk
5. Material: copper
6. Size: 15/20mm
Specification:
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