Descripción
1. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
Specification:
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Payment & Security
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