Description
1. Operating voltage: AC220V/50Hz (AC110V can be customized)
2. Temperature range: 80-250°C
3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
5. Packing list: 13 in 1: host x 1/module x 12/instruction manual x 1/power cable x 1, 9 in 1: host x 1/module x 8/instruction manual x 1/power cable x 1
Functional features:
1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
2. Modular design, a variety of combinations of modules, base universal module, scalability, easy to expand the new module
3. Intelligent temperature control, customized according to different melting point debugging temperature, with fast heating, long life, temperature uniformity
4. 360-degree rotating snap rail design, suitable for different shapes of the motherboard precision clamping, improve maintenance efficiency
5. Accurate positioning module, set up with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and non-slip
6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of cell phone motherboard layering/tinning/laminating/desoldering
7. Real machine testing to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs
Specification:
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