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BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11

filler
Prix:
$58.20
Stock:
En stock

Description


1. Fast and stable, precise positioning
2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.
3. Assist professionals to carry out BGA tin planting in a convenient and safe way.
4. For iPhone A11
5. The strength is more durable and not deformed
6. Dimensions: 85 x 85 x 15mm
7. Weight: 376 grams

Specification:
General
Compatible with
Apple:  iPhone 11
Package Weight
One Package Weight 0.40kgs / 0.89lb
One Package Size 5cm * 3cm * 4cm / 1.97inch * 1.18inch * 1.57inch
Qty per Carton 74
Carton Weight 30.00kgs / 66.14lb
Carton Size 20cm * 12cm * 16cm / 7.87inch * 4.72inch * 6.3inch
Loading Container 20GP: 6944 cartons * 74 pcs = 513856 pcs
40HQ: 16121 cartons * 74 pcs = 1192954 pcs

Payment & Security

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Vos informations de paiement sont gérées de manière sécurisée. Nous ne stockons ni ne pouvons récupérer votre numéro de carte bancaire.

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