Description
1. Adopts closed loop of transducer with Mcu intelligent drive, digital LED display. Fast and stable heating up, good for lead free work.
2. The air flow can be adjustable, and air blowing is low noise and gentle, plastic components won't be deformed.
3. Suitable for removing SOIC, PLCC, chip, QFP and BGA.
4. Intelligent system, alarms when detect fault.
5. Temperature Range: 100-450 Celsius degree.
6. Amount of Wind: 120L/min(MAX).
2. The air flow can be adjustable, and air blowing is low noise and gentle, plastic components won't be deformed.
3. Suitable for removing SOIC, PLCC, chip, QFP and BGA.
4. Intelligent system, alarms when detect fault.
5. Temperature Range: 100-450 Celsius degree.
6. Amount of Wind: 120L/min(MAX).
Specification:
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