MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning

filler

Prix:
Prix réduit$19.67
Stock:
En stock

Description


1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
2. Bright solder joints, no resistance, non-conductive
3. Less residue, less smoke, good flow performance
4. No short circuit, no need to clean, infinite conductivity
5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
6. Weight: about 20g
7. Size: about 12.7 x 2.9cm


Specification:
Package Weight
One Package Weight 0.03kgs / 0.07lb
One Package Size 15cm * 5cm * 5cm / 5.91inch * 1.97inch * 1.97inch
Qty per Carton 210
Carton Weight 7.40kgs / 16.31lb
Carton Size 50cm * 38cm * 32cm / 19.69inch * 14.96inch * 12.6inch
Loading Container 20GP: 438 cartons * 210 pcs = 91980 pcs
40HQ: 1018 cartons * 210 pcs = 213780 pcs

Payment & Security

American Express Apple Pay Diners Club Discover Google Pay JCB Mastercard PayPal Visa

Vos informations de paiement sont gérées de manière sécurisée. Nous ne stockons ni ne pouvons récupérer votre numéro de carte bancaire.

Customer Reviews

Be the first to write a review
0%
(0)
0%
(0)
0%
(0)
0%
(0)
0%
(0)

You may also like