MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning

filler

Price:
Sale price$19.67
Stock:
In stock

Description


1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
2. Bright solder joints, no resistance, non-conductive
3. Less residue, less smoke, good flow performance
4. No short circuit, no need to clean, infinite conductivity
5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
6. Weight: about 20g
7. Size: about 12.7 x 2.9cm


Specification:
Package Weight
One Package Weight 0.03kgs / 0.07lb
One Package Size 15cm * 5cm * 5cm / 5.91inch * 1.97inch * 1.97inch
Qty per Carton 210
Carton Weight 7.40kgs / 16.31lb
Carton Size 50cm * 38cm * 32cm / 19.69inch * 14.96inch * 12.6inch
Loading Container 20GP: 438 cartons * 210 pcs = 91980 pcs
40HQ: 1018 cartons * 210 pcs = 213780 pcs

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