Astra
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Normalpris
$30.36 USD
Normalpris
Udsalgspris
$30.36 USD
Stykpris
pr.
Inklusive skat.
Levering beregnes ved betaling.
Tilgængelighed for afhentning kunne ikke indlæses
1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
Specification:
| Package Weight |
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