Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

1. These templates can be heated for re-filling BGA unit chips, which is very simple and quick
2. It solves the problems encountered by computer maintenance engineers when using directly heated steel nets. It is durable and long-lasting
3. The success rate of tin planting is high. After proficient operation, solder balls can be formed in one go, and it is simple and convenient to use
4. High quality materials, resistant to high temperatures and wear and tear
5. Material: stainless steel