Descripción
1. A variety of models meet the needs of different scenarios for mobile phone repair
2. Ma1.0: pry to remove the glue from IC and CPU
3. Ma2.0: corner knife scraping IC peripheral glue
4. Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
5. Ma4.0: prying IC hard disk
6. Ma5.0: prying CPU IC hard disk and CPU layering
7. Package includes:
2 x Knife Handle
5 x Blades
2. Ma1.0: pry to remove the glue from IC and CPU
3. Ma2.0: corner knife scraping IC peripheral glue
4. Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
5. Ma4.0: prying IC hard disk
6. Ma5.0: prying CPU IC hard disk and CPU layering
7. Package includes:
2 x Knife Handle
5 x Blades
Specification:
| Package Weight |
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Payment & Security
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