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Mijing Z20 Motherboard Middle Layer Planting Tin Platform for iPhone 16 Series
Mijing Z20 Motherboard Middle Layer Planting Tin Platform for iPhone 16 Series
Precio habitual
$39.78 USD
Precio habitual
Precio de oferta
$39.78 USD
Precio unitario
por
Impuesto incluido.
Los gastos de envío se calculan en la pantalla de pago.
No se pudo cargar la disponibilidad de retiro
1. High-Precision Soldering Platform: The Z20 utilizes advanced design processes to ensure high-precision soldering during the motherboard assembly of the 16 series.
2. Designed Specifically for iPhone 16 Series: Tailored for the motherboard of the iPhone 16 series, ensuring a perfect fit and improving soldering effectiveness.
3. Excellent Thermal Conductivity: Made from high-quality thermal conductive materials to ensure rapid heat dissipation during soldering, preventing component overheating damage.
4. Sturdy Support Structure: The robust structural design provides stable support, ensuring precise positioning during soldering.
5. User-Friendly Design: Ergonomic design and easy operation provide an enhanced user experience during use.
2. Designed Specifically for iPhone 16 Series: Tailored for the motherboard of the iPhone 16 series, ensuring a perfect fit and improving soldering effectiveness.
3. Excellent Thermal Conductivity: Made from high-quality thermal conductive materials to ensure rapid heat dissipation during soldering, preventing component overheating damage.
4. Sturdy Support Structure: The robust structural design provides stable support, ensuring precise positioning during soldering.
5. User-Friendly Design: Ergonomic design and easy operation provide an enhanced user experience during use.
Specification:
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